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HCFG SERIES

characteristic

  • This series of products enables high-density packaging with a maximum pitch of 2.54 mm (0.1 inches), takes up less space, and has better electromagnetic interference suppression effects.
  • Offer different types of products with the same appearance.
  • Has excellent physical properties such as terminal strength, bending strength, resistance to soldering heat and solderability.
  • Suitable for flow soldering and reflow soldering.
Availability:
Quantity:
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HUNAN HUASUN M&E TECHNOLOGY CO.,LTD

contact us

Tel: 0745-6711668
Mobile phone: 18797558295
Email: sales@huasuntech.cn
Contact person: Wang Ping
Address: Huachen Science and Technology Park, Luojiu, Zhijiang Dong Autonomous County, Hunan Province

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