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good news! HUASUN Dentsu's HCUN integrated inductor has been certified by Qualcomm in the United States

Views: 0     Author: Site Editor     Publish Time: 2024-12-20      Origin: Site

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good news! Huasheng Dentsu's HCUN integrated inductor has been certified by Qualcomm in the United States

HUASUN Dentsu's HCUN integrated inductor has been certified by Qualcomm in the United States

Hunan HUASUN Dentsu Technology Co., Ltd.'s HCUN2012 series of integrated inductor components has officially passed the platform certification of mobile phone chips and wearable device chipsets by the global technology giant Qualcomm (QUALCOMM). This is another exciting milestone and marks As a result, HUASUN Dentsu's technological innovation and product quality have once again gained international recognition. The following information has been released on Qualcomm's official website. Qualcomm customers can view it by scanning the QR code below or clicking the link below.




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PlatformSM4450

VendorHuasun

HuasunHCUN201210-R47M-D

Verification levelGOLD

https://createpoint.qti.qualcomm.com/hwcomponents/#component/36944/55553


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Features

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  • 1. High reliability, wide operating temperature (-40℃~+125℃), no long-term high temperature aging problem

  • 2. Excellent saturation current characteristics

  • 3. Ultra-low DCR/ACR, low loss, achieving high power conversion efficiency

  • 4. The bottom electrode structure enables high-density mounting and avoids the risk of short circuit between adjacent devices.

  • 5. The products currently cover sizes of 2.0*1.2/2.0*1.6/2.5*2.0/3.2*2.5 mm and can be used in applications requiring high reliability such as servers, power modules, DDR5, and medical equipment.




Product application


  • 1. High-end mobile phones, tablets, and 5G modules

  • 2. Servers, base stations, DDR5, etc.

  • 3. Various DC-DC conversion power modules




HCUN series specifications


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  • 1.All test data is referenced to 25℃ ambient.
  • 2.Irms: DC current (A) that will cause an approximate ΔT of 40℃
  • 3.Isat: DC current (A) that will cause L0 to drop approximately 30%
  • 4.Operating Temperature Range -40℃ to +125℃
  • 5.The part temperature (ambient + temp rise) should not exceed 125℃ under the worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provision all affect the part temperature. Part temperature should be verified in the end application.
  • 6.The rated current as listed is either the saturation current or the heating current depending on which value is lower.


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